mcCAP

mcCAP 2017-02-22T18:08:56+00:00
mcCAP

MCSC Custom Application Platform

Today’s system-on-a-chip(SoC) is a complex design composed of complex IP/cores. Current SoC design approach and methodology, which are based on Standard Cell, are no longer adequate to meet the challenges of SoC design productivity and diminishing time-to-market window.

Your SoC Design Reuse Platform

The industry shift toward design reuse is now progressing from block-level to system level design. To improve SoC productivity, many companies are turning to SoC reuse platform solutions. These application-specific reference designs take advantage of previously created SoC architectures. This approach allows designers to reuse major blocks instead of just a few components.

BaySand’s Metal Configurable Custom Application Platform (mcCAP) is ideal for SoC/ASSP reuse platform solution to significantly improve time-to-market of SoC designs by facilitating the reuse of design, architectures, and components, by customizing only a few metal layers. One can create a new SoC in just few months while reducing development cost and engineering time.

The new design approach to SoC reuse platform can be realized by using BaySand’s mcCAP solution based on MCSC technology.

mcCAP Advantages:

  • Metal Configurable Platform = SoC Reuse Platform + MCSC Technology
  • Common Platform Drives Multiple SoC or ASSPs
  • Fastest TTM/TTV for Segmented Market or Applications
  • Flexible Engagement & Business Model
  • Industry standard design flows and EDA tools identical to traditional
    Standard-Cell for quick adoption and integration

Case Study

mcCAP → Optimum SoC/ASSP

The new design approach to SoC reuse platform can be realized by using BaySand’s mcCAP solution based on MCSC technology.
The SoC silicon realization based on all layer changes using current Standard-Cell may results in disadvantages such as higher development cost, increased design/verification complexities and longer development time hence TTM/TTV.

Take advantage of BaySand’s MCSC Technology and your SoC reuse platform!

Unique SoC/ASSP Shared SoC/ASSP mcCAP
SoC/ASSP
Implementation
# of Mask (All Layers) × (# of Designs) (All Layers) × 1 Fixed Layers +
Conf. Metal Layers × (# Designs)
Advantages
  • Optimum Power & Area
  • Optimum Unit Cost
  • Smaller Mask Cost vs. Unique SoC
  • Optimum Power & Area
  • Compatible Unit Cost
  • Reduced Mask Cost
  • Fast TTM/TTV
Disadvantages
  • High Development Cost
  • Long TTM/TTV
  • Larger Unit Cost
  • Increased Design Complexities
  • Long TTM/TTV

Application Example

Not One Size Fit All

The new design approach to SoC reuse platform can be realized by using BaySand’s mcCAP solution based on MCSC technology.
You can make your product differentiation faster using MCSC Technology and its solutions!