BaySand – Multi Project Wafer (MPW), SoC, ASIC, DSP Solution 2017-08-21T15:54:57+00:00


BaySand Expands its Global Sales Channel Organization to Support ASIC Designers in Europe, Israel and India

December 5th, 2016|

BaySand expands its global sales channel organization by adding reps in Germany, India and Israel to promote BaySand’s Metal Configurable Standard Cell (MCSC) technology and its newly introduced products and services ASIC UltraShuttle program, Metal Copy-28 (MC-28) and fcDSP technology. The MCSC provides a robust ASIC solution supporting quick Time To [...]

BaySand Solutions

FPGA to ASIC Conversion


Seamless FPGA to ASIC Conversion, 5X better performance, 10X lower power

ASIC Multi Project Wafer (MPW)

ASIC UltraShuttle Multi Project Wafer (MPW)

RTL tapeout to working packaged chips Multi Project Wafer (MPW) program. Fully tested and deliver in 8 weeks!

ASIC Solution


Low cost ASIC, low risk, fast TTM/TTV yet optimum power & performance ASIC solution



Reusable custom application platform with optimum power & area with fast TTM/TTV

mcFPGA-T28C for Altera/Xilinx FPGA to 28nm ASIC Conversion
Advanced 28nm mcFPGA
for Stratix V/Virtex UltraScale and more
to 28nm ASIC conversion
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mcFPGA-G40L for Altera/Xilinx FPGA to 40nm ASIC Conversion
Advanced 40nm mcFPGA
for Stratix V/Arria V/Virtex 7/Kintex 7 and more
to 40nm ASIC conversion
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mcFPGA-G65L for Altera/Xilinx FPGA to 65nm ASIC Conversion
Cost-efficient 65nm mcFPGA
for Stratix V/Stratix IV/Arria II/Virtex 6 and more
to 65nm ASIC conversion
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